The implementation of IP-over-IP tunneling (IPIP) and the Generalized Routing Encapsulation (GRE) protocol is based on the creation of a virtual device.

IPIP的实现和通用路由封装协议是基于一个虚拟设备的创建。

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Describe are encapsulation assemblies useful for electronic device, having a substrate and an electrically active area, the encapsulation assembly comprising a barrier sheet;

所述为可用于电子器件的封装组件，所述电子器件具有基片和电有源区，所 述封装组件包括阻挡片；

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